Hanmi Semiconductor announced on the 21st that it has supplied flip-chip ball grid array (FC-BGA) substrate cutting equipment to a domestic customer.
FC-BGA is a substrate used to package high-performance computing chips such as central processing unit (CPU), graphic processing unit (GPU), and neural network processing unit (NPU). As the electric vehicle, artificial intelligence (AI), and data center markets have grown significantly, the demand for these high-performance chips has increased, and the demand for FC-BGA is also growing to the point that the supply is insufficient.
Hanmi Semiconductor explained that it developed 'Micro SAW P1201' that cuts FC-BGA and bundled it with inspection equipment (Vision Placement 8.0) and delivered it to a customer.
Hanmi Semiconductor has imported all microsofts from Japan. However, it developed and challenged itself to strengthen its business competitiveness, and succeeded in localization for the first time this year.
Hanmi Semiconductor is the world's No. 1 'Vision Placement' equipment that cleans, dries, inspects, sorts, and loads semiconductor packages cut from wafers. Vision Placement works in conjunction with the micro saw as a system. Hanmi Semiconductor plans to target the FC-BGA market, where demand is growing, by promoting synergy with Vision Placement.
Reporter Lee Ji-sun stockmk2020@gmail.com
